AMD · TeraScale 1 · 2008
FirePro 3D V8700
FirePro 3D V8700: 1 GB GDDR5, 151 W. Launched September 11, 2008.
- Memory
- 1 GB
- Power
- 151 W
- Bus width
- 256 bit
Memory1 GB
43 of 65 in FirePro
Power151 W
11 of 25 by higher draw in FirePro
Current market
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Specifications
Memory
- Capacity
- 1 GB
- Memory type
- GDDR5
- Bus width
- 256 bit
- Memory clock
- 850 MHz
- Bandwidth
- 108.8 GB/s
Compute
- FP32
- 1,200 GFLOPS
- FP64
- 240 GFLOPS
- Pixel fill rate
- 12 GP/s
- Texture fill rate
- 30 GT/s
Clocks
- Base clock
- 750 MHz
Board
- TDP
- 151 W
- Bus interface
- PCIe 2.1 ×16
- Form factor
- workstation
Physical
- Architecture
- TeraScale 1
- Codename
- RV770 XT
- Process
- 55 nm
- Transistors
- 956 million
- Die size
- 256 mm²
- Series
- FirePro
- Launch date
- September 11, 2008
Not recorded by the source: generation, shaders, tmus and rops, or 4 further fields.
Die figure
Silicon, made visible
Die area is drawn against the largest recorded die in the catalog. Shader dots use a labeled, card-specific ratio so both early and modern GPUs remain legible.
Catalog context
Within its series, the FirePro 3D V8700 ranks 30th of 46 for FP32 throughput and 43rd of 65 for memory capacity. Its 151 W TDP is above the 75 W PCIe slot-power ceiling.
Source: Wikipedia, revision 1364362273 · catalog loaded 2026-08-16