AMD · TeraScale 1 · 2008
FirePro 3D V5700
FirePro 3D V5700: 512 MB GDDR3, 58 W. Launched August 8, 2008.
- Memory
- 512 MB
- Power
- 58 W
- Bus width
- 128 bit
Memory512 MB
56 of 65 in FirePro
Power58 W
20 of 25 by higher draw in FirePro
Current market
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Specifications
Memory
- Capacity
- 512 MB
- Memory type
- GDDR3
- Bus width
- 128 bit
- Memory clock
- 900 MHz
- Bandwidth
- 28.8 GB/s
Compute
- FP32
- 448 GFLOPS
- Pixel fill rate
- 5.6 GP/s
- Texture fill rate
- 22.4 GT/s
Clocks
- Base clock
- 700 MHz
Board
- TDP
- 58 W
- Bus interface
- PCIe 2.0 ×16
- Form factor
- workstation
Physical
- Architecture
- TeraScale 1
- Codename
- RV730 XT
- Process
- 55 nm
- Transistors
- 514 million
- Die size
- 146 mm²
- Series
- FirePro
- Launch date
- August 8, 2008
Not recorded by the source: generation, shaders, tmus and rops, or 5 further fields.
Die figure
Silicon, made visible
Die area is drawn against the largest recorded die in the catalog. Shader dots use a labeled, card-specific ratio so both early and modern GPUs remain legible.
Catalog context
Within its series, the FirePro 3D V5700 ranks 42nd of 46 for FP32 throughput and 56th of 65 for memory capacity. Its 58 W TDP is within the 75 W PCIe slot-power ceiling.
Source: Wikipedia, revision 1364362273 · catalog loaded 2026-08-16