FirePro 3D V3700
AMD
Catalog context
Within its series, the FirePro 3D V3700 ranks 46th of 46 for FP32 throughput and 62nd of 65 for memory capacity. Its 32 W TDP is within the 75 W PCIe slot-power ceiling. The source does not record generation, shaders, tmus and rops, or 5 further fields, for this variant.
| Launch date | August 8, 2008 |
|---|---|
| Series | FirePro |
| Generation | — |
| Codename | RV620 PRO |
| Form factor | workstation |
| Architecture | TeraScale 1 |
| Process | 55 nm |
| Transistors | 181 million |
| Die size | 67 mm² |
| Shaders | — |
| TMUs | — |
| ROPs | — |
| SM count | — |
| Base clock | 800 MHz |
| Boost clock | — |
| Memory clock | 950 MHz |
| Memory | 256 MB |
| Memory type | GDDR3 |
| Bus width | 64 bit |
| Bandwidth | 15.2 GB/s |
| Pixel fill rate | 3.2 GP/s |
| Texture fill rate | 3.2 GT/s |
| FP32 | 64 GFLOPS |
| FP64 | — |
| TDP | 32 W |
| Bus interface | PCIe 2.0 ×16 |
| External power required | — |
| Launch MSRP | — |
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Source: Wikipedia, revision 1364362273 · catalog loaded 2026-08-16