AMD · TeraScale 1 · 2008
FirePro 3D V3700
FirePro 3D V3700: 256 MB GDDR3, 32 W. Launched August 8, 2008.
- Memory
- 256 MB
- Power
- 32 W
- Bus width
- 64 bit
Memory256 MB
62 of 65 in FirePro
Power32 W
25 of 25 by higher draw in FirePro
Current market
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Specifications
Memory
- Capacity
- 256 MB
- Memory type
- GDDR3
- Bus width
- 64 bit
- Memory clock
- 950 MHz
- Bandwidth
- 15.2 GB/s
Compute
- FP32
- 64 GFLOPS
- Pixel fill rate
- 3.2 GP/s
- Texture fill rate
- 3.2 GT/s
Clocks
- Base clock
- 800 MHz
Board
- TDP
- 32 W
- Bus interface
- PCIe 2.0 ×16
- Form factor
- workstation
Physical
- Architecture
- TeraScale 1
- Codename
- RV620 PRO
- Process
- 55 nm
- Transistors
- 181 million
- Die size
- 67 mm²
- Series
- FirePro
- Launch date
- August 8, 2008
Not recorded by the source: generation, shaders, tmus and rops, or 5 further fields.
Die figure
Silicon, made visible
Die area is drawn against the largest recorded die in the catalog. Shader dots use a labeled, card-specific ratio so both early and modern GPUs remain legible.
Catalog context
Within its series, the FirePro 3D V3700 ranks 46th of 46 for FP32 throughput and 62nd of 65 for memory capacity. Its 32 W TDP is within the 75 W PCIe slot-power ceiling.
Source: Wikipedia, revision 1364362273 · catalog loaded 2026-08-16