FirePro 3D V3750
AMD
Catalog context
Within its series, the FirePro 3D V3750 ranks 44th of 46 for FP32 throughput and 62nd of 65 for memory capacity. Its 48 W TDP is within the 75 W PCIe slot-power ceiling. The source does not record generation, shaders, tmus and rops, or 5 further fields, for this variant.
| Launch date | September 11, 2008 |
|---|---|
| Series | FirePro |
| Generation | — |
| Codename | RV730 PRO |
| Form factor | workstation |
| Architecture | TeraScale 1 |
| Process | 55 nm |
| Transistors | 514 million |
| Die size | 146 mm² |
| Shaders | — |
| TMUs | — |
| ROPs | — |
| SM count | — |
| Base clock | 550 MHz |
| Boost clock | — |
| Memory clock | 750 MHz |
| Memory | 256 MB |
| Memory type | GDDR3 |
| Bus width | 128 bit |
| Bandwidth | 24 GB/s |
| Pixel fill rate | 4.4 GP/s |
| Texture fill rate | 17.6 GT/s |
| FP32 | 352 GFLOPS |
| FP64 | — |
| TDP | 48 W |
| Bus interface | PCIe 2.0 ×16 |
| External power required | — |
| Launch MSRP | — |
Explore related indexes
Source: Wikipedia, revision 1364362273 · catalog loaded 2026-08-16