AMD · TeraScale 1 · 2008
FirePro 3D V3750
FirePro 3D V3750: 256 MB GDDR3, 48 W. Launched September 11, 2008.
- Memory
- 256 MB
- Power
- 48 W
- Bus width
- 128 bit
Memory256 MB
62 of 65 in FirePro
Power48 W
22 of 25 by higher draw in FirePro
Current market
Affiliate links — we may earn a commission.
Specifications
Memory
- Capacity
- 256 MB
- Memory type
- GDDR3
- Bus width
- 128 bit
- Memory clock
- 750 MHz
- Bandwidth
- 24 GB/s
Compute
- FP32
- 352 GFLOPS
- Pixel fill rate
- 4.4 GP/s
- Texture fill rate
- 17.6 GT/s
Clocks
- Base clock
- 550 MHz
Board
- TDP
- 48 W
- Bus interface
- PCIe 2.0 ×16
- Form factor
- workstation
Physical
- Architecture
- TeraScale 1
- Codename
- RV730 PRO
- Process
- 55 nm
- Transistors
- 514 million
- Die size
- 146 mm²
- Series
- FirePro
- Launch date
- September 11, 2008
Not recorded by the source: generation, shaders, tmus and rops, or 5 further fields.
Die figure
Silicon, made visible
Die area is drawn against the largest recorded die in the catalog. Shader dots use a labeled, card-specific ratio so both early and modern GPUs remain legible.
Catalog context
Within its series, the FirePro 3D V3750 ranks 44th of 46 for FP32 throughput and 62nd of 65 for memory capacity. Its 48 W TDP is within the 75 W PCIe slot-power ceiling.
Source: Wikipedia, revision 1364362273 · catalog loaded 2026-08-16