AMD · TeraScale 1 · 2009
FirePro 3D V7750
FirePro 3D V7750: 1 GB GDDR3, 76 W. Launched March 27, 2009.
- Memory
- 1 GB
- Power
- 76 W
- Bus width
- 128 bit
Memory1 GB
43 of 65 in FirePro
Power76 W
16 of 25 by higher draw in FirePro
Current market
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Specifications
Memory
- Capacity
- 1 GB
- Memory type
- GDDR3
- Bus width
- 128 bit
- Memory clock
- 900 MHz
- Bandwidth
- 28.8 GB/s
Compute
- FP32
- 512 GFLOPS
- Pixel fill rate
- 6.4 GP/s
- Texture fill rate
- 25.6 GT/s
Clocks
- Base clock
- 800 MHz
Board
- TDP
- 76 W
- Bus interface
- PCIe 2.0 ×16
- Form factor
- workstation
Physical
- Architecture
- TeraScale 1
- Codename
- RV730 XTX
- Process
- 55 nm
- Transistors
- 514 million
- Die size
- 146 mm²
- Series
- FirePro
- Launch date
- March 27, 2009
Not recorded by the source: generation, shaders, tmus and rops, or 5 further fields.
Die figure
Silicon, made visible
Die area is drawn against the largest recorded die in the catalog. Shader dots use a labeled, card-specific ratio so both early and modern GPUs remain legible.
Catalog context
Within its series, the FirePro 3D V7750 ranks 41st of 46 for FP32 throughput and 43rd of 65 for memory capacity. Its 76 W TDP is above the 75 W PCIe slot-power ceiling.
Source: Wikipedia, revision 1364362273 · catalog loaded 2026-08-16