AMD · TeraScale 1 · 2009
FirePro 3D V8750
FirePro 3D V8750: 2 GB GDDR5, 154 W. Launched July 28, 2009.
- Memory
- 2 GB
- Power
- 154 W
- Bus width
- 256 bit
Memory2 GB
23 of 65 in FirePro
Power154 W
10 of 25 by higher draw in FirePro
Current market
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Specifications
Memory
- Capacity
- 2 GB
- Memory type
- GDDR5
- Bus width
- 256 bit
- Memory clock
- 900 MHz
- Bandwidth
- 115.2 GB/s
Compute
- FP32
- 1,200 GFLOPS
- FP64
- 240 GFLOPS
- Pixel fill rate
- 12 GP/s
- Texture fill rate
- 30 GT/s
Clocks
- Base clock
- 750 MHz
Board
- TDP
- 154 W
- Bus interface
- PCIe 2.1 ×16
- Form factor
- workstation
Physical
- Architecture
- TeraScale 1
- Codename
- RV770 XT
- Process
- 55 nm
- Transistors
- 956 million
- Die size
- 256 mm²
- Series
- FirePro
- Launch date
- July 28, 2009
Not recorded by the source: generation, shaders, tmus and rops, or 4 further fields.
Die figure
Silicon, made visible
Die area is drawn against the largest recorded die in the catalog. Shader dots use a labeled, card-specific ratio so both early and modern GPUs remain legible.
Catalog context
Within its series, the FirePro 3D V8750 ranks 30th of 46 for FP32 throughput and 23rd of 65 for memory capacity. Its 154 W TDP is above the 75 W PCIe slot-power ceiling.
Source: Wikipedia, revision 1364362273 · catalog loaded 2026-08-16