FirePro 3D V3800
AMD
Catalog context
Within its series, the FirePro 3D V3800 ranks 40th of 46 for FP32 throughput and 56th of 65 for memory capacity. Its 43 W TDP is within the 75 W PCIe slot-power ceiling. The source does not record generation, shaders, tmus and rops, or 5 further fields, for this variant.
| Launch date | April 26, 2010 |
|---|---|
| Series | FirePro |
| Generation | — |
| Codename | Redwood Pro GL (RV830) |
| Form factor | workstation |
| Architecture | TeraScale 2 |
| Process | 40 nm |
| Transistors | 627 million |
| Die size | 104 mm² |
| Shaders | — |
| TMUs | — |
| ROPs | — |
| SM count | — |
| Base clock | 650 MHz |
| Boost clock | — |
| Memory clock | 900 MHz |
| Memory | 512 MB |
| Memory type | GDDR3 |
| Bus width | 64 bit |
| Bandwidth | 14.4 GB/s |
| Pixel fill rate | 5.2 GP/s |
| Texture fill rate | 13 GT/s |
| FP32 | 520 GFLOPS |
| FP64 | — |
| TDP | 43 W |
| Bus interface | PCIe 2.1 ×16 |
| External power required | — |
| Launch MSRP | — |
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Source: Wikipedia, revision 1364362273 · catalog loaded 2026-08-16