AMD · TeraScale 2 · 2010
FirePro 3D V3800
FirePro 3D V3800: 512 MB GDDR3, 43 W. Launched April 26, 2010.
- Memory
- 512 MB
- Power
- 43 W
- Bus width
- 64 bit
Memory512 MB
56 of 65 in FirePro
Power43 W
23 of 25 by higher draw in FirePro
Current market
Affiliate links — we may earn a commission.
Specifications
Memory
- Capacity
- 512 MB
- Memory type
- GDDR3
- Bus width
- 64 bit
- Memory clock
- 900 MHz
- Bandwidth
- 14.4 GB/s
Compute
- FP32
- 520 GFLOPS
- Pixel fill rate
- 5.2 GP/s
- Texture fill rate
- 13 GT/s
Clocks
- Base clock
- 650 MHz
Board
- TDP
- 43 W
- Bus interface
- PCIe 2.1 ×16
- Form factor
- workstation
Physical
- Architecture
- TeraScale 2
- Codename
- Redwood Pro GL (RV830)
- Process
- 40 nm
- Transistors
- 627 million
- Die size
- 104 mm²
- Series
- FirePro
- Launch date
- April 26, 2010
Not recorded by the source: generation, shaders, tmus and rops, or 5 further fields.
Die figure
Silicon, made visible
Die area is drawn against the largest recorded die in the catalog. Shader dots use a labeled, card-specific ratio so both early and modern GPUs remain legible.
Catalog context
Within its series, the FirePro 3D V3800 ranks 40th of 46 for FP32 throughput and 56th of 65 for memory capacity. Its 43 W TDP is within the 75 W PCIe slot-power ceiling.
Source: Wikipedia, revision 1364362273 · catalog loaded 2026-08-16