FirePro S7150 X2
AMD
Catalog context
Within its series, the FirePro S7150 X2 ranks second of 46 for FP32 throughput and second of 65 for memory capacity. Its 265 W TDP is above the 75 W PCIe slot-power ceiling. The source does not record generation, transistors, die size and sm count, or 4 further fields, for this variant.
| Launch date | February 1, 2016 |
|---|---|
| Series | FirePro |
| Generation | — |
| Codename | 2× Tonga PRO GL |
| Form factor | datacenter |
| Architecture | GCN 3 |
| Process | 28 nm |
| Transistors | — |
| Die size | — |
| Shaders | 1,792 |
| TMUs | 112 |
| ROPs | 32 |
| SM count | — |
| Base clock | 1,050 MHz |
| Boost clock | — |
| Memory clock | 1,250 MHz |
| Memory | 16 GB |
| Memory type | GDDR5 |
| Bus width | 256 bit |
| Bandwidth | — |
| Pixel fill rate | 33.6 GP/s |
| Texture fill rate | 117.6 GT/s |
| FP32 | 7,540 GFLOPS |
| FP64 | 500 GFLOPS |
| TDP | 265 W |
| Bus interface | PCIe 3.0 x16 |
| External power required | — |
| Launch MSRP | — |
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Source: Wikipedia, revision 1364362273 · catalog loaded 2026-08-16