GPUSPECINDEX

AMD · TeraScale 2 · 2010

FirePro 3D V9800

FirePro 3D V9800: 4 GB GDDR5, 225 W. Launched September 9, 2010.

Memory
4 GB
Power
225 W
Bus width
256 bit
Memory4 GB13 of 65 in FirePro
Power225 W7 of 25 by higher draw in FirePro

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Memory

Capacity
4 GB
Memory type
GDDR5
Bus width
256 bit
Memory clock
1,150 MHz
Bandwidth
147.2 GB/s

Compute

FP32
2,720 GFLOPS
FP64
544 GFLOPS
Pixel fill rate
27.2 GP/s
Texture fill rate
68 GT/s

Clocks

Base clock
850 MHz

Board

TDP
225 W
Bus interface
PCIe 2.1 ×16
Form factor
workstation

Physical

Architecture
TeraScale 2
Codename
Cypress XT GL (RV870)
Process
40 nm
Transistors
2.154 billion
Die size
334 mm²
Series
FirePro
Launch date
September 9, 2010

Not recorded by the source: generation, shaders, tmus and rops, or 4 further fields.

Silicon, made visible

Die area is drawn against the largest recorded die in the catalog. Shader dots use a labeled, card-specific ratio so both early and modern GPUs remain legible.

334 mm² die · shader count not recordedDie area drawn to scale against the catalog maximum of 1,540 square millimeters. Shader count not recorded.334 mm² die · shader count not recordedShader count not recordedDashed frame = largest catalog die (1,540 mm²)

Within its series, the FirePro 3D V9800 ranks 18th of 46 for FP32 throughput and 13th of 65 for memory capacity. Its 225 W TDP is above the 75 W PCIe slot-power ceiling.

Source: Wikipedia, revision 1364362273 · catalog loaded 2026-08-16