AMD · TeraScale 2 · 2010
FirePro 3D V7800
FirePro 3D V7800: 2 GB GDDR5, 138 W. Launched April 26, 2010.
- Memory
- 2 GB
- Power
- 138 W
- Bus width
- 256 bit
Memory2 GB
23 of 65 in FirePro
Power138 W
14 of 25 by higher draw in FirePro
Current market
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Specifications
Memory
- Capacity
- 2 GB
- Memory type
- GDDR5
- Bus width
- 256 bit
- Memory clock
- 1,000 MHz
- Bandwidth
- 128 GB/s
Compute
- FP32
- 2,016 GFLOPS
- FP64
- 403.2 GFLOPS
- Pixel fill rate
- 22.4 GP/s
- Texture fill rate
- 50.4 GT/s
Clocks
- Base clock
- 700 MHz
Board
- TDP
- 138 W
- Bus interface
- PCIe 2.1 ×16
- Form factor
- workstation
Physical
- Architecture
- TeraScale 2
- Codename
- Cypress Pro GL (RV870)
- Process
- 40 nm
- Transistors
- 2.154 billion
- Die size
- 334 mm²
- Series
- FirePro
- Launch date
- April 26, 2010
Not recorded by the source: generation, shaders, tmus and rops, or 4 further fields.
Die figure
Silicon, made visible
Die area is drawn against the largest recorded die in the catalog. Shader dots use a labeled, card-specific ratio so both early and modern GPUs remain legible.
Catalog context
Within its series, the FirePro 3D V7800 ranks 24th of 46 for FP32 throughput and 23rd of 65 for memory capacity. Its 138 W TDP is above the 75 W PCIe slot-power ceiling.
Source: Wikipedia, revision 1364362273 · catalog loaded 2026-08-16