AMD · TeraScale 2 · 2012
FirePro V3900
FirePro V3900: 1 GB GDDR3, 50 W. Launched February 7, 2012.
- Memory
- 1 GB
- Power
- 50 W
- Bus width
- 128 bit
Memory1 GB
43 of 65 in FirePro
Power50 W
21 of 25 by higher draw in FirePro
Current market
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Specifications
Memory
- Capacity
- 1 GB
- Memory type
- GDDR3
- Bus width
- 128 bit
- Memory clock
- 900 MHz
- Bandwidth
- 28.8 GB/s
Compute
- FP32
- 624 GFLOPS
- Pixel fill rate
- 5.2 GP/s
- Texture fill rate
- 15.6 GT/s
Clocks
- Base clock
- 650 MHz
Board
- TDP
- 50 W
- Bus interface
- PCIe 2.1 ×16
- Form factor
- workstation
Physical
- Architecture
- TeraScale 2
- Codename
- Turks GL
- Process
- 40 nm
- Series
- FirePro
- Launch date
- February 7, 2012
Not recorded by the source: generation, transistors, die size and shaders, or 7 further fields.
Die figure
Silicon, made visible
Die area is drawn against the largest recorded die in the catalog. Shader dots use a labeled, card-specific ratio so both early and modern GPUs remain legible.
Catalog context
Within its series, the FirePro V3900 ranks 37th of 46 for FP32 throughput and 43rd of 65 for memory capacity. Its 50 W TDP is within the 75 W PCIe slot-power ceiling.
Source: Wikipedia, revision 1364362273 · catalog loaded 2026-08-16