GPUSPECINDEX

Intel · 2023

Data Center GPU Max 1100

Data Center GPU Max 1100: 48 GB HBM2E, 300 W, 7,168 Shading units. Launched January 10, 2023.

Memory
48 GB
Power
300 W
Bus width
3,072 bit
Memory48 GB3 of 3 in Data Center GPU
Power300 W3 of 3 by higher draw in Data Center GPU
Shading units7,1683 of 3 in Data Center GPU

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Memory

Capacity
48 GB
Memory type
HBM2E
Bus width
3,072 bit
Bandwidth
1,228.8 GB/s

Compute

Shading units
7,168
TMUs
448
ROPs
0
Pixel fill rate
0 GP/s

Board

TDP
300 W
Bus interface
PCIe 5.0 x16

Physical

Codename
Xe-HPC (Ponte Vecchio)
Transistors
100 billion
Die size
1,280 mm²
Series
Data Center GPU
Launch date
January 10, 2023

Not recorded by the source: generation, form factor, architecture and process, or 9 further fields.

Silicon, made visible

Die area is drawn against the largest recorded die in the catalog. Shader dots use a labeled, card-specific ratio so both early and modern GPUs remain legible.

1,280 mm² die · 7,168 shadersDie area drawn to scale against the catalog maximum of 1,540 square millimeters. Each dot = 64 shaders.1,280 mm² die · 7,168 shadersEach dot = 64 shadersDashed frame = largest catalog die (1,540 mm²)

Within its series, the Data Center GPU Max 1100 ranks third of 3 for memory capacity. Its 300 W TDP is above the 75 W PCIe slot-power ceiling.

Source: Wikipedia, revision 1368155295 · catalog loaded 2026-08-16