Intel · 2023
Data Center GPU Max 1100
Data Center GPU Max 1100: 48 GB HBM2E, 300 W, 7,168 Shading units. Launched January 10, 2023.
- Memory
- 48 GB
- Power
- 300 W
- Bus width
- 3,072 bit
Memory48 GB
3 of 3 in Data Center GPU
Power300 W
3 of 3 by higher draw in Data Center GPU
Shading units7,168
3 of 3 in Data Center GPU
Current market
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Specifications
Memory
- Capacity
- 48 GB
- Memory type
- HBM2E
- Bus width
- 3,072 bit
- Bandwidth
- 1,228.8 GB/s
Compute
- Shading units
- 7,168
- TMUs
- 448
- ROPs
- 0
- Pixel fill rate
- 0 GP/s
Board
- TDP
- 300 W
- Bus interface
- PCIe 5.0 x16
Physical
- Codename
- Xe-HPC (Ponte Vecchio)
- Transistors
- 100 billion
- Die size
- 1,280 mm²
- Series
- Data Center GPU
- Launch date
- January 10, 2023
Not recorded by the source: generation, form factor, architecture and process, or 9 further fields.
Die figure
Silicon, made visible
Die area is drawn against the largest recorded die in the catalog. Shader dots use a labeled, card-specific ratio so both early and modern GPUs remain legible.
Catalog context
Within its series, the Data Center GPU Max 1100 ranks third of 3 for memory capacity. Its 300 W TDP is above the 75 W PCIe slot-power ceiling.
Source: Wikipedia, revision 1368155295 · catalog loaded 2026-08-16