NVIDIA · Fermi (derived from codename prefix) · 2012

GeForce GT 640 OEM Rebrand

Memory1,536 MB28 of 93 in GeForce GT
Power75 W4 of 90 by higher draw in GeForce GT
Shaders14433 of 98 in GeForce GT

Silicon, made visible

Die area is drawn against the largest recorded die in the catalog. Shader dots use a labeled, card-specific ratio so both early and modern GPUs remain legible.

238 mm² die · 144 shadersDie area drawn to scale against the catalog maximum of 1,540 square millimeters. Each dot = 1 shader.238 mm² die · 144 shadersEach dot = 1 shaderDashed frame = largest catalog die (1,540 mm²)

Specifications

Memory

Capacity
1,536 MB
Type
DDR3
Bus width
192 bit
Memory clock
800 MHz
Bandwidth
38.4 GB/s

Compute

Shaders
144
SM count
3
TMUs
24
ROPs
24
FP32
414.72 GFLOPS
Pixel fill rate
17.28 GP/s
Texture fill rate
17.28 GT/s

Clocks

Boost clock
720 MHz

Board

TDP
75 W
Bus interface
PCIe 2.0 x16
External power required
No
Form factor
desktop

Physical

Architecture
Fermi (derived from codename prefix)
Codename
GF116-150-A1
Process
40 nm
Transistors
1.17 billion
Die size
238 mm²
Series
GeForce GT
Launch date
April 24, 2012

Not recorded by the source: generation, base clock, fp64 and launch msrp.

Catalog context

Within its series, the GeForce GT 640 OEM Rebrand ranks 19th of 53 for FP32 throughput and 28th of 93 for memory capacity. Its 75 W TDP is within the 75 W PCIe slot-power ceiling.

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Source: Wikipedia, revision 1369488585 · catalog loaded 2026-08-16